China's thinning grinding wheel supply capacity to improve, the pace of domestic substitution will accelerate
Release time:
2024-06-04
China is a semiconductor wafer production and consumption of large countries
China is a semiconductor wafer production and consumption of large countries, but the rate of self-sufficiency of high-end wafers is still low, in order to fill the technology and product gaps, thinning grinding wheel, wafer scribing blades and other semiconductor cutting and grinding tools are urgently needed to realize the domestic supply. At present, the domestic thinning grinding wheel market accounted for a relatively low, in 10% or so, the future substitution space is very broad. Thinning wheel types are more, according to add different materials, thinning wheel can be divided into silicon carbide grinding wheel, diamond grinding wheel, alumina grinding wheel, gallium arsenide grinding wheel, ceramic grinding wheel, resin grinding wheel and so on.
Thinning wheel is mainly used in the semiconductor wafer thinning and fine research processing links, is one of the important tools for wafer thinning. Thinning process is to grind and cut the material on the back of the chip to make it reach the target thickness, thinning process can not only reduce the package volume, enhance the circuit performance, but also conducive to chip heat dissipation and improve service life. In recent years, with the development of chip miniaturization and the upgrading of heat dissipation demand, the application demand for thinning grinding wheels has been released.
Key words:
Grinding tools and abrasives
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